(8 / 10 inches) Vertical Semiconductor Grinding Machine | Joen Lih: Precision CNC Grinding Machines for Medical & Semiconductor Industries
Continuing the superior characteristics of vertical grinding, Vertical Semiconductor Grinding Machine features an innovative air-floating spindle, primarily designed for precision grinding of hard and brittle materials that demand high surface accuracy and flatness. The overall grinding machine body is based on a high-rigidity welded structure, ensuring exceptional stability. Combined with the special non-contact design of the precision spindle, it significantly reduces mechanical vibration and noise. Equipped with the advanced Fanuc Oi controller, it enables high-precision mechanical motion. The wafer surface roughness achieved can reach Ra 0.12 micrometers, ensuring high precision and superior surface smoothness in the machining results. JOENLIH is Taiwan custom precision Linear Blocks Grinding Machine, Wafer Grinding Machine, Precision Surface Grinding Machine manufacturer since 1988. With 30+ years in Taiwan's grinding machine industry, we provide customized solutions for diverse needs, from small to large-scale operations. Our dedication to innovation guarantees high-quality products and added value, earning trust globally. Discover Taiwan's premier grinding machine manufacturer, serving the industry for over 30 years. We offer tailored solutions from small to large-scale needs, prioritizing continuous innovation, top-quality products, and customizable services. Explore our range and experience the difference.
(8 / 10 inches) Vertical Semiconductor Grinding Machine
JL-200SCG / JL-300SCGII
Continuing the superior characteristics of vertical grinding, Vertical Semiconductor Grinding Machine features an innovative air-floating spindle, primarily designed for precision grinding of hard and brittle materials that demand high surface accuracy and flatness.
The overall grinding machine body is based on a high-rigidity welded structure, ensuring exceptional stability. Combined with the special non-contact design of the precision spindle, it significantly reduces mechanical vibration and noise.
Equipped with the advanced Fanuc Oi controller, it enables high-precision mechanical motion. The wafer surface roughness achieved can reach Ra 0.12 micrometers, ensuring high precision and superior surface smoothness in the machining results.
Features
- Air Floating Table: The worktable specifications are divided into 200SGC (8 inches) and 300SCGII (12 inches), with a rotational accuracy of up to 0.1μm. Equipped with ceramic vacuum chucks, this prevents surface scratches and indentations caused by negative pressure during workpiece handling.
- Hight Precision Spindle: The motor is built in the spindle assembly. The spindle running accuracy reaches 0.1 μm. Variable spindle speed ranges from 1000 to 5000 RPM.
- Main Structure: High-rigidity welded structure, offering exceptional stability to ensure reduced vibrations during the machining process and effectively enhance grinding precision.
- Electrical Control System: Equipped with the advanced Fanuc Oi controller, it enables high-precision mechanical motion.
Standard Accessories
- Diamond grinding wheel.
- Flange.
- Ceramic vacuum suction table.
- Spindle temperature controller.
- Vacuum pump.
- Tool box with tool kits.
Optional Accessories
- Precision dryer.
- Height gauge.
Application
- Brittle Special Composite Materials: This machine is designed for precision grinding for various workplace materials, such as wafers, ceramics, quartz, glass and gems, etc.
Specification
| Model | JL-200SCG | JL-300SCGII |
|---|---|---|
| MAX. Grinding Capacity | ||
| Working Table Diameter | Ø200mm | Ø300mm |
| Spindle | ||
| From | Air floating spindle | Air floating spindle |
| Number of Spindles (mm) | 1 | 1 |
| Servo Motor Power | 3.7kw | 11kw |
| Speed (rpm) | 1000 ~ 5000rpm | 1000 ~ 3000rpm |
| tool | Ø250mm diamond grinding wheel |
Ø350mm diamond grinding wheel |
| Z Axis | ||
| Stroke | 120mm | 120 - 200mm |
| Feed Resolution | 0.1μm | 0.1μm |
| Max. Rapid Movement Speed | 300 mm/min | 300 mm/min |
| Table | ||
| Stroke | Air floating spindle | Air floating spindle |
| Number of table | 1 | 1 |
| Max. Speed | 0 ~ 500rpm | 0 ~ 500rpm |
| Thickness Gauge (Optional) | ||
| Measuring Range | 0 ~ 1000rpm | - |
| Resolution | 0.1μm | - |
| Repeatability | ± 0.5μm | - |
| Weight | ||
| Machine Weight | 2000kg | 3000kg |
| Dimensions | ||
| Machine Space | 600 (W) x 1700 (D) x 2100 (H) mm | 1100 (W) x 1950 (D) x 2100 (H) mm |
| Machining Accuracy | ||
| TTV | 1.5μm | 3μm |
| Thickness Tolerance | - | ± 3μm |
| Surface Roughness | Ra 0.02μm | Ra 0.02μm (For Wafer) |
| Floor Space | ||
| L x W (incl. Peripheral Equip.) | 3000 (L) x 2500 (W) mm | 2200 (L) x 1700 (W) mm |
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(8 / 10 inches) Vertical Semiconductor Grinding Machine | Joen Lih: Advanced Grinding Solutions for Aerospace & Automotive
JOEN LIH MACHINERY CO., LTD., founded in 1988, is a leading global manufacturer of precision grinding machines, including high-precision (8 / 10 inches) Vertical Semiconductor Grinding Machine, flat grinders, profile grinders, and advanced semiconductor polishing equipment. With over 20 years of industry expertise, we offer customized solutions for sectors like medical, aerospace, semiconductor, and automotive, ensuring unmatched stability and precision.
Dedicated to innovation, Joen Lih integrates automation and cutting-edge technologies to deliver superior grinding machinery. We are committed to expanding our global reach, enhancing production efficiency and customer satisfaction across key markets in Asia, Europe, and the Americas.
JOENLIH has been a leading provider of precision grinding machinery for over 20 years, consistently leveraging cutting-edge technology to deliver customized solutions that meet and exceed each customer's specific requirements.
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