Silicon Wafer Material | Joen Lih: Custom CNC Precision Grinding & Semiconductor Polishing
The standard silicon wafer thinning machine utilizes a vertical grinding machine to thin one side of the wafer to the required thickness specified by the customer. Following this, it is followed immediately by a double-sided polishing machine, paired with suitable polishing pads and polishing fluid, to achieve a mirrored finish on both sides.In order to meet the requirements for wafer thinning and polishing, Joen Lih offers: JOENLIH is Taiwan cutting-edge Linear Blocks Grinding Machine, Wafer Grinding Machine, Precision Surface Grinding Machine manufacturer since 1988. With 30+ years in Taiwan's grinding machine industry, we provide customized solutions for diverse needs, from small to large-scale operations. Our dedication to innovation guarantees high-quality products and added value, earning trust globally. Discover Taiwan's premier grinding machine manufacturer, serving the industry for over 30 years. We offer tailored solutions from small to large-scale needs, prioritizing continuous innovation, top-quality products, and customizable services. Explore our range and experience the difference.
Silicon Wafer Material
Grinding and Polishing
The standard silicon wafer thinning machine utilizes a vertical grinding machine to thin one side of the wafer to the required thickness specified by the customer. Following this, it is followed immediately by a double-sided polishing machine, paired with suitable polishing pads and polishing fluid, to achieve a mirrored finish on both sides.
In order to meet the requirements for wafer thinning and polishing, Joen Lih offers:
Vertical Grinding Machine:
- Constant radius grinding optimizes the flatness and speed of wafer grinding.
- Available for various professional control systems (PLC / CNC).
- Automatic cleaning and automatic loading / unloading.
Double-sided Polishing Machine:
- Machine driven by four-axis or three-axis servo motors.
- Available for various professional control systems (PLC / CNC).
- Precisely controlling the pressure applied during polishing using load cells.
- Online thickness detection.
In addition, Joen Lih also accommodates partial customization of equipment based on customer requirements.
- Customized PLC interface, customizable multi-stage settings for grinding and polishing recipes.
- Customized automatic cleaning and loading / unloading.
- Customized online monitoring for grinding and polishing.
Download Silicon Wafer Material | Custom CNC Grinding and Polishing Solutions by Joen Lih
JOEN LIH MACHINERY CO., LTD., founded in 1988, is a leading global manufacturer of precision grinding machines, including high-precision Silicon Wafer Material, flat grinders, profile grinders, and advanced semiconductor polishing equipment. With over 20 years of industry expertise, we offer customized solutions for sectors like medical, aerospace, semiconductor, and automotive, ensuring unmatched stability and precision.
Dedicated to innovation, Joen Lih integrates automation and cutting-edge technologies to deliver superior grinding machinery. We are committed to expanding our global reach, enhancing production efficiency and customer satisfaction across key markets in Asia, Europe, and the Americas.
JOENLIH has been a leading provider of precision grinding machinery for over 20 years, consistently leveraging cutting-edge technology to deliver customized solutions that meet and exceed each customer's specific requirements.
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