(16 inches) Semiconductor Double-sided Grinding and Polishing Machine | Joen Lih: Precision CNC Grinding Machines for Medical & Semiconductor Industries
The JL-D16 double-sided grinding machine is an efficient surface processing device designed for various non-metallic and hard materials. It is suitable for surface processing of commonly used materials in semiconductor manufacturing, such as silicon wafers, quartz, silicon carbide, glass, and more. The JL-D16 is primarily utilized for double-sided grinding or polishing of flat workpieces. It can also be employed for processing workpiece thicknesses, with a minimum achievable thickness of 0.4mm. Additionally, the surface precision can reach 0.3μm, ensuring a high level of machining accuracy.The innovative JL-D16 double-sided grinding machine combines both double-sided grinding and polishing functions, making it a comprehensive and efficient solution for surface treatment applications. JOENLIH is Taiwan custom precision Linear Blocks Grinding Machine, Wafer Grinding Machine, Precision Surface Grinding Machine manufacturer since 1988. With 30+ years in Taiwan's grinding machine industry, we provide customized solutions for diverse needs, from small to large-scale operations. Our dedication to innovation guarantees high-quality products and added value, earning trust globally. Discover Taiwan's premier grinding machine manufacturer, serving the industry for over 30 years. We offer tailored solutions from small to large-scale needs, prioritizing continuous innovation, top-quality products, and customizable services. Explore our range and experience the difference.
(16 inches) Semiconductor Double-sided Grinding and Polishing Machine
JL-D16
The JL-D16 double-sided grinding machine is an efficient surface processing device designed for various non-metallic and hard materials. It is suitable for surface processing of commonly used materials in semiconductor manufacturing, such as silicon wafers, quartz, silicon carbide, glass, and more.
The JL-D16 is primarily utilized for double-sided grinding or polishing of flat workpieces. It can also be employed for processing workpiece thicknesses, with a minimum achievable thickness of 0.4mm. Additionally, the surface precision can reach 0.3μm, ensuring a high level of machining accuracy.
The innovative JL-D16 double-sided grinding machine combines both double-sided grinding and polishing functions, making it a comprehensive and efficient solution for surface treatment applications.
Features
- Grinding Mechanism: The lapping mechanism running is designed with a planetary type design to achieve the optimal lapping performance and surface finish.
- Dual Functionality in One Machine: It can simultaneously perform double-sided grinding or polishing for flat workpieces, with a minimum processing thickness of 0.4mm. The surface precision can reach up to 0.3μm.
- Multi-tasking of Workpieces: Five sets of carriers (planetary carriers) are employed to simultaneously hold multiple workpieces during the lapping process.
- Intelligent Electrical Control System: The machine is equipped with a PLC controller, optionally complemented by a touchscreen, ensuring user-friendly operation.
Optional Accessories
- The automatic thickness control.
- PLC controller in combination with the use of the touchscreen.
Application
- Surface Treatment of Non-metallic and Hard Brittle Materials: Includes silicon wafers, quartz, SiC, glass, sapphire, ceramic substrates, as well as processing metallic materials such as aluminum, stainless steel, and mechanical seals.
Specification
| Model | |
|---|---|
| Diameter of Lapping Plate | 1127mm |
| Diameter of Carrier (Planetary Carrier) | Ø 370mm DP12,Z200 |
| Quantity of Carrier (Planetary Carrier) | 5 SETS |
| Total Processed Quantity | 6" Wafer: 15 (pcs) (3pc / carrier) 8" Wafer: 5 (pcs) (1pc / carrier) 12" Wafer: 5 (pcs) (1pc / carrier) |
| Automatic Thickness Control | Optional |
| Pressing Method | Air Cylinder Pressing |
| Pressure Control | Electronic Proportional |
| Touchscreen | Optional |
| Controller | PLC + Touchscreen |
| Internal Gear Disc | 3 HP |
| Upper Plate Drive Horsepower | 5 HP |
| Lower Plate Drive Horsepower | 15 HP |
| Lapping Plate Speed | 20 ~ 60 R.P.M. |
| Pressure on Lapping Plate | 10 ~ 300 KG |
| Max. Lapping Thickness | 40 mm |
| Min. Lapping Thickness | 0.4 mm |
| Machine Dimensions | W: 2300 x D: 1420 x H: 2550 mm |
| Machine Net Weight | 6200 KGS |
| Power Source | 3Ø 220V (3Ø 380V) |
- Video
Showcasing the grinding process of the double-sided grinding machine (JL-D16), including steps such as adjusting the grinding plate, loading the workpiece, lapping, and unloading the workpiece.
Demonstrating the polishing process of the double-sided polishing machine (JL-D16), including steps such as adjusting the polishing plate, loading the workpiece, polishing, and unloading the workpiece.
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(16 inches) Semiconductor Double-sided Grinding and Polishing Machine | Joen Lih: Advanced Grinding Solutions for Aerospace & Automotive
JOEN LIH MACHINERY CO., LTD., founded in 1988, is a leading global manufacturer of precision grinding machines, including high-precision (16 inches) Semiconductor Double-sided Grinding and Polishing Machine, flat grinders, profile grinders, and advanced semiconductor polishing equipment. With over 20 years of industry expertise, we offer customized solutions for sectors like medical, aerospace, semiconductor, and automotive, ensuring unmatched stability and precision.
Dedicated to innovation, Joen Lih integrates automation and cutting-edge technologies to deliver superior grinding machinery. We are committed to expanding our global reach, enhancing production efficiency and customer satisfaction across key markets in Asia, Europe, and the Americas.
JOENLIH has been a leading provider of precision grinding machinery for over 20 years, consistently leveraging cutting-edge technology to deliver customized solutions that meet and exceed each customer's specific requirements.
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